Honor, a sub-brand from Huawei, finally released its newest smartphone, the Honor X10 Max. This news has been confirmed by posting from the president of the company through his Weibo account, and he said that his new smartphone would be released on July 2, 2020.
President of Honor Zhao Ming, in a post on his Weibo account, said if the X series will carry the big screen.
Zhao said because it has been two years they did not make a smartphone with a wide screen. The company also promised a comprehensive increase in the X series.
He also said that the Honor X10 Max was nothing new to him, because the company itself is preparing a phablet with a wide screen and Pro version for the X10 series going forward.
Leaked Specifications from Honor X10 Max
Instead of using Kirin, Honor prefers to use SoC from Mediatek, namely Dimensity 800. Honor reasoned because they did not want the launch timeline to be disrupted due to their dispute with US.
Mediatek Dimensity 800 is a Mid-range SoC that can provide competitive performance in its class. This SoC is built on a 7nm process with the support of NSA / SA 5G with dual-carrier aggregation.
With this support, it can make the 5G network increase by 30% for seamless connectivity and more efficient use of batteries. Honor X10 Max is said to have a main camera with a resolution of 48MP and 8MP for the front camera.
For batteries, this smartphone is equipped with a 5000mAh battery and fast charging support of up to 22.5W. Honor X10 Max will be present using the Magic UI 3.1 interface based on Android 10.